TSMC considering advanced chip packaging capacity in Japan, sources say

March 18, 2024

Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry. Demand for advanced semiconductor packaging has surged globally in tandem with the artificial intelligence boom, spurring chipmakers including TSMC, Samsung Electronics and Intel, to boost capacity. The chipmaker also established an advanced packaging research and development centre in Ibaraki prefecture, northeast of Tokyo in 2021. TrendForce analyst Joanne Chiao said, however, that if TSMC were to build advanced packaging capacity in Japan, she expected it would be limited in scale. Samsung is setting up an advanced packaging research facility in Yokohama, southwest of Tokyo, with government support.

The source of this news is from Tuoi Tre News